Mechanic Solder Paste Flux 183 Degree 10CC XG-Z40 with Syringe Needle tip for PCB SMD Mobile Phone Repair XG Z40 Soldering Paste
QR25.00
Mechanic Solder Paste Flux 183 Degree 10CC XG-Z40 with Syringe Needle tip for PCB SMD Mobile Phone Repair XG Z40 Soldering Paste
10CC Mechanic Tin XG-Z40 Solder Paste Flux 25-45um Syringe for PCB SMD Mobile Phone Repair XG Z40 Soldering Paste
MECHANIC XG-Z40 High synthetic BGA Solder Flux Paste Soldering Tin Cream 10ml solder paste tin. Applicable to PCB, BGA, SMD, PGA repair. Mechanic solder tin paste xg-z40 Solder Paste Flux 25-45um Syringe to Mobile Phone Repair Services Indust
MECHANIC XG-Z40 High synthetic BGA Solder Flux Paste BGA Soldering Tin Cream
PCB BGA Soldering Paste Flux Solder BAG Ball Flux Paste
The BGA Flux Solder Paste is a high viscosity no-clean flux, it can be used for PCB, SMD, reworking, it can be used for soldering and reballing of computer and phone chips.
It is a mixture of high-quality alloyed powder and resinic pasty flux, it can avoid the pale yellow residue, so you are easy to clean the board.
Function:
Soldering paste for cell phone PCB and SMD etc.
Help to repair the circuit boards and protect the electronic components
A necessary material for repairing the mobile phone mainboard
Flux Solder Paste – no clean soldering
MECHANIC BGA Solder Flux Paste Soldering Tin Cream
Specification:
Material: tin+solder paste
Color: As picture shown
Size: Approx. 1.30*1.30*1.14inch / 3.3*3.2*2.9cm
Type: XG-Z40
Microns: 25-45um
Only logged in customers who have purchased this product may leave a review.
Reviews
There are no reviews yet.